Odisha
Odisha Becomes India’s First State to Host 3D Semiconductor Chip Packaging Unit
- 21 Apr 2026
- 2 min read
Why in News?
Odisha has marked a major milestone in India’s technology sector with the establishment of the country’s first advanced 3D chip packaging (3D Glass Substrate) manufacturing unit at Info Valley, Bhubaneswar.
Key Points
- First of its Kind: Odisha becomes the first state in India to host an advanced 3D semiconductor chip packaging unit, placing the country in the global advanced chip manufacturing ecosystem.
- The facility will start commercial production by August 2028 and is expected to be fully operational by 2030.
- The initiative aligns with India’s Semiconductor Mission and strengthens the goal of making India self-reliant in chip manufacturing.
- Investment: The project involves a total investment of around ₹2,000 crore.
- The plant is expected to manufacture around 70,000 glass panels annually, along with millions of advanced semiconductor chips.
- Technology: The facility will use 3D heterogeneous integration (3DHI) and glass substrate packaging technology.
- The chips produced will support critical sectors such as Artificial Intelligence (AI), 5G/6G communication, defence technology, aerospace, and data centres.
- Global Collaboration: The project is being developed in partnership with US-based 3D Glass Solutions (3DGS).
| Read More: India’s Semiconductor Mission |
